The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Dec. 16, 2015
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventor:

Takahiro Yamanaka, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, Aichi-pref., JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H05K 7/20 (2006.01); H02K 11/33 (2016.01); H02K 9/22 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H02K 11/33 (2016.01); H01L 23/36 (2013.01); H05K 7/20454 (2013.01); H01L 2023/405 (2013.01); H01L 2924/18301 (2013.01); H02K 9/22 (2013.01);
Abstract

An electronic device has a substrate, a heat sink, and a heat conductive material. The substrate has a first surface on which an electronic part is arranged. The heat sink has (i) a second surface facing the first surface and distanced from the electronic part and (ii) an annular groove extending annularly and defining an area that is circled by the annular groove on the second surface and faces the electronic part. The heat conductive material is arranged between the first surface and the second surface to be in contact with the electronic part and the annular groove. The heat conductive material guides heat generated by the electronic part to the heat sink.


Find Patent Forward Citations

Loading…