The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

May. 22, 2017
Applicant:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Inventors:

Jimmy G. Hester, Atlanta, GA (US);

Evan P. Nguyen, Irvine, CA (US);

Vesna Radisic, Manhattan Beach, CA (US);

Jesse B. Tice, Torrance, CA (US);

Andrew D. Smith, Rancho Palos Verdes, CA (US);

Assignee:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 1/203 (2006.01); H01P 3/08 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 1/203 (2013.01); H01P 3/081 (2013.01); H01P 11/003 (2013.01);
Abstract

A microstrip transmission line comprising a dielectric substrate including a series of periodic sinusoidal undulation portions defining spaced apart peaks and troughs, where a distance between the peaks and troughs defines a period of the microstrip line, and where each peak defines a maximum height of the substrate and each trough defines a minimum height of the substrate. The transmission line further includes a conductive strip formed to a surface of the substrate so that the conductive strip follows the undulation portions. The conductive strip includes a modulation portion in a width direction of the conductive strip perpendicular to a signal propagation direction along the strip, where the modulation portion includes a minimum width portion provided at each peak and a maximum width portion provided at each trough so that a variation of a ratio between the width of the conductive strip and the height of the substrate is maximized.


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