The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Mar. 25, 2015
Corning Precision Materials Co., Ltd., Chungcheongnam-do, KR;
Yoon Seuk Oh, Chungcheongnam-do, KR;
Ki Yeon Lee, Chungcheongnam-do, KR;
Hyung Soo Moon, Chungcheongnam-do, KR;
Bo Mi Kim, Chungcheongnam-do, KR;
Jhee Mann Kim, Chungcheongnam-do, KR;
Cheol Min Park, Chungcheongnam-do, KR;
Choon Bong Yang, Chungcheongnam-do, KR;
Abstract
The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional color conversion frit heat-treatment process and cutting process after bonding between the color conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package characterized in that the present invention comprises: a color conversion frit formation step for forming a color conversion frit in which phosphor is included on a substrate; a color conversion frit transcription step for transcribing the color conversion frit formed on the substrate from the substrate to a transcription film; and a color conversion frit bonding step for bonding the color conversion frit transcribed on the transcription film onto a light-emitting diode package.