The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Feb. 23, 2018
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventor:

Ken Nakata, Yokohama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 21/02 (2006.01); H01L 29/267 (2006.01); H01L 29/24 (2006.01); H01L 29/205 (2006.01); H01L 21/306 (2006.01); H01L 21/467 (2006.01); H01L 29/08 (2006.01); H01L 29/22 (2006.01); H01L 29/227 (2006.01); H01L 21/465 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66969 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02554 (2013.01); H01L 21/02565 (2013.01); H01L 21/30621 (2013.01); H01L 21/465 (2013.01); H01L 21/467 (2013.01); H01L 29/0843 (2013.01); H01L 29/0847 (2013.01); H01L 29/205 (2013.01); H01L 29/22 (2013.01); H01L 29/227 (2013.01); H01L 29/24 (2013.01); H01L 29/267 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 21/02458 (2013.01); H01L 21/02502 (2013.01); H01L 21/02576 (2013.01); H01L 29/2003 (2013.01);
Abstract

A HEMT made of nitride semiconductor materials and a process of forming the same are disclosed, where the HEMT has n-type regions beneath the source and drain electrodes with remarkably increased carrier concentration. The HEMT provides the n-type regions made of at least one of epitaxially grown ZnO layer and MgZnO layer each doped with at least aluminum and gallium with density higher than 1×10cm. The process of forming the HEMT includes steps of forming recesses by dry-etching, epitaxially growing n-type layer, removing surplus n-type layer except within the recesses by dry-etching using hydrocarbon, and forming the electrodes on the n-type layer.


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