The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Mar. 08, 2017
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Franz Hirler, Isen, DE;

Gabor Mezoesi, Villach, AT;

Hans Weber, Bayerisch Gmain, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/02 (2006.01); H01L 21/225 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/408 (2013.01); H01L 21/02236 (2013.01); H01L 21/2253 (2013.01); H01L 21/26533 (2013.01); H01L 21/324 (2013.01); H01L 29/0634 (2013.01); H01L 29/401 (2013.01); H01L 29/407 (2013.01); H01L 29/66712 (2013.01); H01L 29/7802 (2013.01); H01L 29/7811 (2013.01);
Abstract

According to an embodiment of a method of forming a semiconductor device, a semiconductor layer including a first dopant species of a first conductivity type and a second dopant species of a second conductivity type different from the first conductivity type is formed. The semiconductor layer is part of a semiconductor body having opposite first and second surfaces. Trenches are formed in the semiconductor layer at the first surface. The trenches are filled with a filling material including at least a semiconductor material. A thermal oxide is formed at one or both of the first and second surfaces, the thermal oxide having a thickness of at least 200 nm. Thermal processing of the semiconductor body causes diffusion of the first and second dopants species into the filling material.


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