The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Mar. 05, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Tsutomu Kiyosawa, Toyama, JP;

Atsushi Ohoka, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 29/78 (2006.01); H01L 29/16 (2006.01); H01L 29/417 (2006.01); H01L 29/32 (2006.01); H01L 29/872 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 21/02 (2006.01); H01L 21/04 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 22/12 (2013.01); H01L 29/0619 (2013.01); H01L 29/0696 (2013.01); H01L 29/0865 (2013.01); H01L 29/1095 (2013.01); H01L 29/32 (2013.01); H01L 29/41741 (2013.01); H01L 29/66068 (2013.01); H01L 29/66143 (2013.01); H01L 29/66712 (2013.01); H01L 29/7802 (2013.01); H01L 29/872 (2013.01); H01L 21/02378 (2013.01); H01L 21/02529 (2013.01); H01L 21/02634 (2013.01); H01L 21/0465 (2013.01);
Abstract

Semiconductor deviceincludes semiconductor substratedrift layerfirst electrodeand second electrodeSemiconductor substrateis of a first conductivity type and is formed of a silicon carbide semiconductor, a gallium nitride semiconductor, or the like. For example, semiconductor substrateis an n-type silicon carbide semiconductor substrate. Drift layeris an epitaxial semiconductor layer of the first conductivity type which is formed on upper surfaceof semiconductor substrateby epitaxial growth. Drift layeris formed of for example, an n-type silicon carbide semiconductor. Drift layerhas a thickness of t. For example, the thickness t is between about 5 μm and about 100 μm (inclusive).


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