The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Jun. 02, 2017
Applicants:
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Inventors:
Assignees:
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/04 (2006.01); H01L 25/065 (2006.01); H05K 1/02 (2006.01); H01L 23/538 (2006.01); H05K 1/14 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/04 (2013.01); H01L 23/49811 (2013.01); H01L 23/5381 (2013.01); H01L 23/5386 (2013.01); H01L 25/0652 (2013.01); H05K 1/0203 (2013.01); H05K 1/144 (2013.01); H01L 23/367 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10522 (2013.01);
Abstract
A hybrid-type power module having dual-sided cooling is provided. The power module includes semiconductor chips that is disposed on each of an upper board and a lower board at a location between the boards. The semiconductor chips of the upper board and the lower board have different electric capacities.