The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

May. 27, 2015
Applicant:

University of Florida Research Foundation, Inc., Gainesville, FL (US);

Inventors:

Yong-Kyu Yoon, Gainesville, FL (US);

Cheolbok Kim, Gainesville, FL (US);

Hyup Jong Kim, Gainesville, FL (US);

David Eliecer Senior, Cartagena Bolivar, CO;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 7/08 (2006.01); H01L 23/66 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01P 1/203 (2006.01); H01P 11/00 (2006.01); H01Q 1/38 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01P 1/20381 (2013.01); H01P 7/08 (2013.01); H01P 11/003 (2013.01); H01Q 1/38 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0306 (2013.01); H05K 2201/10378 (2013.01);
Abstract

Various integrated high quality electronic components and systems, and methods of their manufacture, are presented. In one example, a device includes a glass substrate or interposer including one or more metalized through-glass vias (TGVs). The one or more metalized TGVs can be used to form a substrate integrated waveguide, a complementary split ring resonator, a disc loaded monopole antenna or other device. An array of metalized TGVs can define side walls of the integrated waveguide. A disc coupled to a tip of a metalized TGV can provide capacitive disc loading of the monopole antenna.


Find Patent Forward Citations

Yoon, Yong-Kyu. (2019). Glass interposer integrated high quality electronic components and systems (U.S. Patent No. 10211169). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10211169

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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