The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Sep. 05, 2017
Applicant:

Toshiba Memory Corporation, Tokyo, JP;

Inventor:

Kouji Matsuo, Ama Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/768 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2006.01); H01L 23/532 (2006.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 23/585 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/53295 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 27/11582 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a first semiconductor circuit layer including a first conductive layer, a second semiconductor circuit layer including a second conductive layer, and a third semiconductor circuit layer between the first semiconductor circuit layer and the second semiconductor circuit layer, the third semiconductor circuit layer including a third conductive layer in contact with the first conductive layer, a fourth conductive layer in contact with the second conductive layer, and a fifth conductive layer in contact with the third conductive layer and electrically connected to the fourth conductive layer. The fifth conductive layer has a width that is narrower than a width of the third conductive layer.


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