The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Jul. 04, 2016
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Shinichi Kohda, Kyoto, JP;

Junichi Kimura, Osaka, JP;

Ryosuke Usui, Hokkaido, JP;

Tomohide Ogura, Osaka, JP;

Atsushi Watanabe, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01L 23/36 (2006.01); H01L 23/49 (2006.01); H01L 23/58 (2006.01); H01L 23/48 (2006.01); H05K 7/20 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 23/36 (2013.01); H01L 23/48 (2013.01); H01L 23/4951 (2013.01); H01L 23/49558 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/585 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H05K 7/20 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84801 (2013.01);
Abstract

This semiconductor device includes a semiconductor element mounted on a metal layer, first to third connection terminals that are provided on the semiconductor element, a first bus bar bonded to the first connection terminal, and a second bus bar bonded to the second connection terminal. The semiconductor element is bonded to the metal layer, and the first to third connection terminals are disposed on a top surface of the semiconductor element. One end of the first bus bar is bonded to the first connection terminal, another end of the first bus bar is an output unit, one end of the second bus bar is bonded to the second connection terminal, and another end of the second bus bar is bonded to the metal layer. A first surface of the semiconductor element and the second bus bar are at an identical potential.


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