The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

May. 19, 2017
Applicant:

Lockheed Martin Corporation, Bethesda, MD (US);

Inventors:

Daniel W. Harris, Mercerville, NJ (US);

John Ditri, Huntingdon Valley, PA (US);

Joseph W. Hahn, Erial, NJ (US);

Michael K. McNulty, Cherry Hill, NJ (US);

Assignee:

Lockheed Martin Corporation, Bethesda, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); H01L 23/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/46 (2013.01); F28D 15/00 (2013.01);
Abstract

An electronic chip package includes a base defining a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening. A dielectric body is arranged on the base and configured to support an electronic device. The dielectric body comprises a coolant flow chamber formed in a first surface thereof, and a plurality of impingement openings formed within the coolant flow chamber. The plurality of impingement openings are in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber. The body further comprises a coolant return port formed within the coolant flow chamber and in communication with the fluid outlet opening of the base.


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