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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10211122 B1

PDFFull Text
Date of Patent:
Feb. 19, 2019

Filed:

Dec. 26, 2014

Semiconductor module including a case and base board

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Hajime Kato, Tokyo, JP;

Mikio Ishihara, Tokyo, JP;

Yuji Imoto, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Caleb Henry

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/367 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/057 (2006.01); H01L 23/24 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 23/057 (2013.01); H01L 23/24 (2013.01); H01L 23/3737 (2013.01); H01L 23/4006 (2013.01); H01L 23/473 (2013.01); H01L 23/4735 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 23/3735 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/37599 (2013.01); H01L 2224/40137 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/181 (2013.01);
Abstract

An object of the present invention is to provide a semiconductor module with high heat dissipation at a low cost. A semiconductor module according to the present invention includes: a case having a hollow portion; a base board made of an aluminum alloy having a first portion corresponding to the hollow portion of the case, and a second portion corresponding to a main body portion of the case, the base board being attached to a bottom face of the case via the second portion; a ceramic insulating substrate disposed on the first portion of the base board; a wiring pattern disposed on the ceramic insulating substrate; semiconductor elements disposed on the wiring pattern; metal wiring boards connected to the semiconductor elements; and a sealing resin that seals the hollow portion of the case.

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