The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
May. 26, 2016
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/36 (2006.01); H01L 23/66 (2006.01); H01L 23/047 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 23/36 (2013.01); H01L 23/66 (2013.01); H01L 23/047 (2013.01); H01L 23/552 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2223/6644 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/162 (2013.01); H01L 2924/163 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A semiconductor device according to the present invention includes a mounting section provided with a chip mounting region for mounting a semiconductor chip, a frame provided in the mounting section so as to surround the chip mounting region, a cap disposed in contact with the frame so as to cover a space surrounded by the chip mounting region and the frame and a joint that joins the frame and the cap outside a contact surface between the frame and the cap.