The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Jun. 12, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Moon Gi Cho, Anyang-si, KR;

Byungju Kang, Seoul, KR;

Janie Hyojin Kim, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/8234 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 27/06 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76816 (2013.01); H01L 21/02107 (2013.01); H01L 21/76877 (2013.01); H01L 21/823475 (2013.01); H01L 23/528 (2013.01); H01L 23/5223 (2013.01); H01L 27/0629 (2013.01);
Abstract

A semiconductor device and a fabricating method thereof are provided. The method includes sequentially forming an interlayer insulating layer and a hard mask layer on a substrate with first and second regions, performing a first patterning process on the hard mask layer to form first openings in the first and second regions, performing a second patterning process on the hard mask layer to form second openings in the first and second regions, and performing a third patterning process on the hard mask layer to selectively form at least one third opening in only the second region. The third patterning process includes forming a first photoresist pattern with openings on the hard mask layer, and the opening of the first photoresist pattern on the first region is overlapped with the second opening on the first region, when viewed in a plan view.


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