The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Mar. 08, 2018
Applicant:
Didrew Technology (Bvi) Limited, San Jose, CA (US);
Inventor:
Chunbin Zhang, Fremont, CA (US);
Assignee:
DIDREW TECHNOLOGY (BVI) LIMITED, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/78 (2006.01); C09J 7/20 (2018.01); C09J 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6715 (2013.01); B32B 43/006 (2013.01); C09J 5/00 (2013.01); C09J 7/201 (2018.01); H01L 21/6708 (2013.01); H01L 21/67051 (2013.01); H01L 21/67092 (2013.01); H01L 21/6836 (2013.01); H01L 21/7813 (2013.01); B32B 43/003 (2013.01); B32B 2457/14 (2013.01); C09J 2203/326 (2013.01); C09J 2205/302 (2013.01); H01L 2221/68381 (2013.01); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1126 (2015.01); Y10T 156/1933 (2015.01);
Abstract
A method of debonding a temporarily adhesive-bonded carrier-workpiece pair employs a stream of a solvent at a high pressure. The carrier and the workpiece are bonded with an adhesive that is dissolvable in a selected solvent. The workpiece such as a device wafer may have been thinned and processed. The solvent is applied to the adhesive at a high pressure to debond and dissolve the adhesive with high throughput. The dissolved adhesive can be recycled and later reused, thus lowering the cost of the whole bonding and debonding process.