The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Feb. 23, 2017
Applicant:

Semes Co., Ltd., Cheonan-si, Chungcheongnam-do, KR;

Inventors:

Dae Min Kim, Cheonan-si, KR;

Soyoung Park, Hapcheon-gun, KR;

Muhyeon Lee, Cheonan-si, KR;

Assignee:

Semes Co., Ltd., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/00 (2006.01); B05D 1/02 (2006.01); B05D 1/34 (2006.01); B05D 1/36 (2006.01); B05D 3/00 (2006.01); B05D 7/00 (2006.01); B08B 3/00 (2006.01); B08B 3/02 (2006.01); B08B 3/04 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B05D 1/002 (2013.01); B05D 1/005 (2013.01); B05D 1/02 (2013.01); B05D 1/34 (2013.01); B05D 1/36 (2013.01); B05D 3/002 (2013.01); B05D 7/52 (2013.01); B08B 3/00 (2013.01); B08B 3/024 (2013.01); B08B 3/04 (2013.01); H01L 21/02041 (2013.01);
Abstract

An apparatus and a method for treating a substrate with liquid are disclosed. The substrate treating apparatus comprises a substrate supporting unit for supporting the substrate, a liquid supply unit for supplying a liquid to the substrate supported on the substrate supporting unit, and a controller for controlling the liquid supply unit, wherein the liquid supply unit comprises a first nozzle for supplying a first liquid and a second nozzle for supplying a second liquid, and a second area where the second liquid is supplied on the substrate is provided within a first area where the first liquid is supplied on the substrate. The first liquid and the second liquid supplied with a hydrophobic film are discharged with different ways from each other. Thereby, particles with various sizes may be removed depending on each discharge methods.


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