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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10210971 B1

PDFFull Text
Date of Patent:
Feb. 19, 2019

Filed:

Apr. 18, 2017

Chip component

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Hiroshi Tamagawa, Kyoto, JP;

Hiroki Yamamoto, Kyoto, JP;

Katsuya Matsuura, Kyoto, JP;

Yasuhiro Kondo, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01C 1/14 (2006.01); H01C 10/16 (2006.01); H01C 17/00 (2006.01); H01G 5/40 (2006.01); H01L 33/62 (2010.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H01F 29/08 (2006.01); H01F 41/04 (2006.01); H01L 27/15 (2006.01); H01G 5/011 (2006.01); H01G 5/38 (2006.01); H01L 27/08 (2006.01); H01C 17/23 (2006.01); H01C 10/50 (2006.01); H01F 27/28 (2006.01); H01F 27/40 (2006.01); H01F 29/00 (2006.01); H01L 25/10 (2006.01); H01L 25/13 (2006.01); H01L 23/00 (2006.01); H01G 4/33 (2006.01); H01G 4/38 (2006.01); H01G 4/40 (2006.01); H01G 2/16 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01C 1/14 (2013.01); H01C 10/16 (2013.01); H01C 10/50 (2013.01); H01C 17/006 (2013.01); H01C 17/23 (2013.01); H01F 27/2804 (2013.01); H01F 27/40 (2013.01); H01F 29/00 (2013.01); H01F 29/08 (2013.01); H01F 41/041 (2013.01); H01G 2/16 (2013.01); H01G 4/33 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H01G 5/011 (2013.01); H01G 5/38 (2013.01); H01G 5/40 (2013.01); H01L 24/32 (2013.01); H01L 25/105 (2013.01); H01L 25/13 (2013.01); H01L 27/0802 (2013.01); H01L 27/15 (2013.01); H01L 33/62 (2013.01); H05K 1/181 (2013.01); H05K 3/3442 (2013.01); H05K 3/3478 (2013.01); H01F 17/0006 (2013.01); H01L 2221/68304 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01); H01L 2933/0066 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10212 (2013.01); H05K 2203/0415 (2013.01); Y02P 70/613 (2015.11);
Abstract

A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

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