The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Mar. 02, 2016
Nitto Denko Corporation, Osaka, JP;
Yoshito Fujimura, Osaka, JP;
NITTO DENKO CORPORATION, Osaka, JP;
Abstract
A method for producing a wired circuit board includes a first step of preparing a metal supporting layer; a second step of forming an insulating layer having a first opening and terminal forming portions on the metal supporting layer; a third step of forming a conductor layer having terminal portions and an electrically conductive portion on the insulating layer; a fourth step of, by partially removing the metal supporting layer, forming a metal supporting frame portion, a metal supporting connecting portion, and a reinforcement metal supporting portion; and a fifth step of forming a metal plating layer at surfaces of the terminal portions by electrolytic plating via the metal supporting connecting portion.