The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Jul. 21, 2017
Applicant:
Hoya Corporation, Tokyo, JP;
Inventors:
Kazuhiro Hamamoto, Tokyo, JP;
Yoichi Usui, Tokyo, JP;
Assignee:
HOYA CORPORATION, Shinjuku-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2006.01); G03F 1/24 (2012.01); G03F 1/38 (2012.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 1/24 (2013.01); B32B 7/02 (2013.01); G03F 1/38 (2013.01); G03F 7/20 (2013.01); B32B 2307/416 (2013.01); B32B 2551/00 (2013.01);
Abstract
A conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 μm×1 μm of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA-BA)/(BD-BD) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.