The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Apr. 20, 2018
Applicant:

Didrew Technology (Bvi) Limited, Santa Clara, CA (US);

Inventors:

Minghao Shen, San Jose, CA (US);

Xiaotian Zhou, Fremont, CA (US);

Yijiang Hu, Santa Clara, CA (US);

Shaolin Zou, Santa Clara, CA (US);

Assignee:

DIDREW TECHNOLOGY (BVI) LIMITED, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1345 (2006.01); G02F 1/1368 (2006.01); G02F 1/1335 (2006.01); H01L 27/12 (2006.01); H05K 1/18 (2006.01); G02F 1/133 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1368 (2013.01); G02F 1/13306 (2013.01); G02F 1/133514 (2013.01); H01L 27/1214 (2013.01); H05K 1/189 (2013.01); H05K 2201/10136 (2013.01);
Abstract

Disclosed is a display module and method of manufacturing the same, where the display module comprises a LCD panel, a driver IC for driving the LCD panel, and a FPC electrically coupled to the driver IC. The LCD panel includes an array of TFT pixels on a TFT array substrate. The TFT array substrate defines a driver cavity and one or more die cavities in which the driver IC and one or more other IC dies are disposed. The driver IC includes an image signal input pad and a driving signal output pad. The driver IC is configured to receive image signals from the FPC, to process the image signals into drive signals, and to transmit the drive signals to TFT pixels via an RDL electrical connection and a through-glass via through the TFT array substrate.


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