The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Jan. 27, 2015
Shanghai Sansi Electronic Engineering Co., Ltd, Shanghai, CN;
Shanghai Sansi Science and Technology Development Co., Ltd, Shanghai, CN;
Jiashan Sansi Photoelectric Technology Co., Ltd, Jiaxing, Zhejiang, CN;
Bishou Chen, Shanghai, CN;
Li Xu, Shanghai, CN;
Peng Wang, Shanghai, CN;
Xiaoliang He, Shanghai, CN;
Sheng Li, Shanghai, CN;
Haibo Liu, Shanghai, CN;
SHANGHAI SANSI ELECTRONIC ENGINEERING CO., LTD, Shanghai, CN;
SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD, Shanghai, CN;
JIASHAN SANSI PHOTOELECTRIC TECHNOLOGY CO., LTD, Jiaxing, Zhejiang, CN;
Abstract
An LED light device and a circuit preparation method thereof are provided. The LED light device includes a base, an LED light unit, and a lamp shade. The LED light-emitting unit and the lamp shade are arranged on the base. The lamp shade covers the LED light-emitting unit inside. The circuit preparation method includes following steps of: providing a base which is a physical entity having a three-dimensional structure on the surface thereof; coating a circuit layer on the base surface through a programmable coating equipment, manual coating or the combined mode, wherein the circuit layer is a liquid or powder coating containing metal materials, and the thickness of the circuit layer is 20 μm or more; baking the base coated with the circuit layer at the high temperature of 100-1,000° C. until the circuit layer is dried; and obtaining a base having a three-dimensional circuit after cooling.