The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Jan. 05, 2016
Applicant:

Funai Electric Co., Ltd., Osaka, JP;

Inventor:

Steven W. Bergstedt, Winchester, KY (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F04B 19/00 (2006.01); F04B 19/24 (2006.01); F04B 49/06 (2006.01); F04B 49/10 (2006.01);
U.S. Cl.
CPC ...
F04B 19/006 (2013.01); F04B 19/24 (2013.01); B01L 2400/0442 (2013.01); F04B 49/065 (2013.01); F04B 49/10 (2013.01); F04B 2201/0801 (2013.01);
Abstract

A microfluidic pump with thermal control. The microfluidic pump employs a fluid motivation mechanism that moves microscopic fluid volumes through a conduit using thermal vapor bubbles generated using supercritical heating. Aspects of the microfluidic pump include the use of a pump temperature controller that monitors temperatures associated with the microfluidic pump and slows or pauses operation of the microfluidic pump to reduce the rate at which heat is generated allowing additional time for heat to be passively dissipated. Controlling the upper microfluidic pump temperature prevents or reduces overheating of the fluid being pumped that renders the fluid less suitable or unsuitable for its intended purpose or harm to the microfluidic pump. Other aspects of the pump temperature controller include an optional substrate heater that helps raise the fluid temperature to a selected operational range for better performance of the fluid and/or the microfluidic pump.


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