The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Jul. 31, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Keum Seok Park, Seoul, KR;

Sunjung Kim, Suwon-si, KR;

Yihwan Kim, Seongnam-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/04 (2006.01); C30B 33/12 (2006.01); C30B 25/12 (2006.01); C30B 25/14 (2006.01); C30B 31/16 (2006.01); C30B 31/14 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
C30B 33/12 (2013.01); C30B 25/12 (2013.01); C30B 25/14 (2013.01); C30B 31/14 (2013.01); C30B 31/16 (2013.01); H01L 21/02057 (2013.01); H01L 21/0257 (2013.01); H01L 21/0262 (2013.01); H01L 21/02532 (2013.01); H01L 29/66545 (2013.01); H01L 29/66636 (2013.01);
Abstract

Disclosed is a substrate treating apparatus comprising a wafer chuck on which a substrate is placed, an injector unit on a side of the wafer chuck and injecting process gases that include a first gas and a second gas, and a gas supply unit supplying the process gases to the injector unit. The gas supply unit comprises first and second gas supply sources that respectively accommodate the first and second gases, first and second gas supply lines that respectively connect the first and second gas supply sources to the injector unit, and first and second heating units that are respectively disposed on the first and second gas supply lines. The first heating units disposed on the first gas supply line have a density per unit length greater than the density per unit length of the second heating units disposed on the second gas supply line.


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