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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10208164 B1

PDFFull Text
Date of Patent:
Feb. 19, 2019

Filed:

Aug. 26, 2015

Curable silicone composition, curable hot-melt silicone, and optical device

Applicant:

Dow Corning Toray Co., Ltd., Tokyo, JP;

Inventors:

Ryota Dogen, Chiba, JP;

Haruna Yamazaki, Chiba, JP;

Makoto Yoshitake, Chiba, JP;

Assignee:

Dow Corning Toray Co., Ltd., Tokyo, JP;

Attorney:

Warner Norcross & Judd LLP

Primary Examiner:

Kuo Liang Peng

Int. Cl.
CPC ...
C08G 77/04 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 33/52 (2010.01); H01L 33/56 (2010.01); C09D 183/04 (2006.01); C08G 77/12 (2006.01); C08G 77/16 (2006.01); C08G 77/20 (2006.01); C08L 83/04 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
C08G 77/04 (2013.01); C08G 77/12 (2013.01); C08G 77/16 (2013.01); C08G 77/20 (2013.01); C08G 77/70 (2013.01); C08L 83/04 (2013.01); C09D 183/04 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 33/52 (2013.01); H01L 33/56 (2013.01); C08G 77/80 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa·s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.

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