The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10208161 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 19, 2019

Filed:

Mar. 25, 2016
Applicant:

Adeka Corporation, Tokyo, JP;

Inventors:

Takashi Murakami, Saitama, JP;

Chikako Kasai, Saitama, JP;

Hiroshi Ikeda, Saitama, JP;

Assignee:

ADEKA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/10 (2006.01); C08L 1/00 (2006.01); C08L 1/02 (2006.01); C09K 3/00 (2006.01); C09K 3/10 (2006.01); C08G 63/12 (2006.01); C08G 63/91 (2006.01); C08L 67/02 (2006.01); C08L 1/14 (2006.01); C08B 15/00 (2006.01);
U.S. Cl.
CPC ...
C08G 63/12 (2013.01); C08G 63/91 (2013.01); C08K 5/10 (2013.01); C08L 1/00 (2013.01); C08L 1/02 (2013.01); C08L 67/02 (2013.01); C09K 3/00 (2013.01); C09K 3/1015 (2013.01); C08B 15/00 (2013.01);
Abstract

Provided are: a resin modifier which is capable of imparting a resin with excellent moisture resistance, dimensional stability and optical properties; and a resin composition including the same. The resin modifier contains a compound represented by the following Formula (1):


Find Patent Forward Citations

Murakami, Takashi. (2019). Resin modifier and resin composition using same (U.S. Patent No. 10208161). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10208161

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