The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Jul. 26, 2017
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Hiroyuki Tsuchiya, Suwa, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B81C 3/00 (2006.01); C09J 5/00 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); B41J 2/161 (2013.01); B41J 2/1612 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B81C 3/001 (2013.01); C09J 5/00 (2013.01); B32B 2307/538 (2013.01); B81B 2201/052 (2013.01); B81C 2203/032 (2013.01);
Abstract
A manufacturing method of a joined body in which a plurality of structures are joined to each other, the method including forming of an adhesive layer on one face of a medium; adjusting of viscosity of the adhesive layer formed in the forming of the adhesive layer; transcribing the adhesive layer of which viscosity is adjusted in the adjusting of viscosity to the structure; and measuring of surface roughness of the adhesive layer on a transcribing film in a stage before the transcribing.