The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Sep. 23, 2015
Applicant:

Amcor Flexibles Singen Gmbh, Singen, DE;

Inventor:

Susanne Mayer, Steisslingen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B32B 15/08 (2006.01); B32B 15/085 (2006.01); B32B 15/20 (2006.01); B32B 3/08 (2006.01); B65D 75/32 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B32B 3/085 (2013.01); B32B 15/085 (2013.01); B32B 15/20 (2013.01); B65D 75/325 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/308 (2013.01); B32B 2435/02 (2013.01);
Abstract

The present invention relates to a lid film for packaging of e.g. human or pet food. The lid film has a multi-layer structure and comprises a sealing layer, a barrier layer, a print primer layer, a print layer, an optional print protection layer, and a relief layer. The sealing layer, the barrier layer, the print primer layer, the print layer and the optional print protection layer are essentially flat. The relief layer is arranged at least on a part of the print layer and comprises at least n three dimensional structures per cmprojecting at an essentially right angle from a surface of the adjacent print layer or the optional print protection layer and said three dimensional structures forming an non-continuous elevated surface, wherein the total of said elevated surface area formed by the three dimensional structures equals at least m % of a total surface area of the lid film and wherein the three dimensional structures have a minimal height of 5 μm.


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