The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Sep. 30, 2015
Applicant:
Sekisui Chemical Co., Ltd., Osaka, JP;
Inventors:
Tetsuhiro Kato, Kyoto, JP;
Naoyuki Nagatani, Shunan, JP;
Assignee:
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/18 (2006.01); B32B 7/12 (2006.01); C08J 9/00 (2006.01); C08J 9/14 (2006.01); B32B 27/06 (2006.01); B32B 27/36 (2006.01); H01L 23/373 (2006.01); C08J 9/30 (2006.01); C08K 3/34 (2006.01);
U.S. Cl.
CPC ...
B32B 5/18 (2013.01); B32B 7/12 (2013.01); B32B 27/065 (2013.01); B32B 27/36 (2013.01); C08J 9/0066 (2013.01); H01L 23/3733 (2013.01); H01L 23/3737 (2013.01); B32B 2250/02 (2013.01); B32B 2307/54 (2013.01); C08J 9/142 (2013.01); C08J 9/30 (2013.01); C08J 2201/026 (2013.01); C08J 2203/12 (2013.01); C08J 2383/04 (2013.01); C08K 3/34 (2013.01); C09J 2201/606 (2013.01); H01L 23/3731 (2013.01);
Abstract
A thermally conductive foam sheet for electronic equipment according to the present invention is a sheet-shaped foam sheet comprising a silicone resin (A), and thermal conductor particles (B) and bubbles dispersed in the silicone resin (A), wherein a content of the thermal conductor particles (B) is 100 to 400 parts by mass based on 100 parts by mass of the silicone resin (A), and the foam sheet further has a 25% compressive strength of 200 kPa or less and a thickness of 0.8 mm or less.