The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

May. 18, 2015
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Naoto Matsuyuki, Tokyo-to, JP;

Bin Yi, Beijing, CN;

Dezheng Qu, Cupertino, CA (US);

Jairam Manjunathaiah, Cupertino, CA (US);

Scott M. Nathanson, Cupertino, CA (US);

Trevor J. Ness, Cupertino, CA (US);

David I. Nazzaro, Groveland, MA (US);

Raul A. Molina, Emeryville, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); B29C 70/74 (2006.01); C03C 25/005 (2018.01); B29C 70/88 (2006.01); B24B 37/025 (2012.01); B24B 37/02 (2012.01);
U.S. Cl.
CPC ...
B24B 37/042 (2013.01); B24B 37/02 (2013.01); B24B 37/025 (2013.01); B29C 70/745 (2013.01); B29C 70/88 (2013.01); C03C 25/005 (2013.01);
Abstract

A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.


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