The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Sep. 14, 2016
Applicant:

Pacesetter, Inc., Sylmar, CA (US);

Inventors:

John R. Gonzalez, McKinney, TX (US);

Jeffrey Urbanski, Frisco, TX (US);

Tommy Cushing, Prosper, TX (US);

Assignee:

PACESETTER, INC., Sylmar, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/05 (2006.01); A61N 1/36 (2006.01); H05K 3/18 (2006.01); H05K 3/28 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 3/06 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
A61N 1/0551 (2013.01); A61N 1/36071 (2013.01); H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/0032 (2013.01); H05K 3/064 (2013.01); H05K 3/18 (2013.01); H05K 3/28 (2013.01); H05K 3/42 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/05 (2013.01);
Abstract

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.


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