The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Nov. 22, 2016
Applicant:

Liqid Inc., Lafayette, CO (US);

Inventors:

Jason Breakstone, Broomfield, CO (US);

Andrew R. Heyd, Longmont, CO (US);

Seth Walsh, Superior, CO (US);

Christopher R. Long, Colorado Springs, CO (US);

Michael D. Harrington, Golden, CO (US);

Assignee:

Liqid Inc., Broomfield, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); G06F 13/40 (2006.01); G06F 13/42 (2006.01); H05K 7/20 (2006.01); H05K 7/14 (2006.01); G11B 33/12 (2006.01); G11B 33/14 (2006.01);
U.S. Cl.
CPC ...
H05K 5/026 (2013.01); G06F 13/4022 (2013.01); G06F 13/4068 (2013.01); G06F 13/4081 (2013.01); G06F 13/4282 (2013.01); G11B 33/128 (2013.01); G11B 33/142 (2013.01); H05K 7/1489 (2013.01); H05K 7/1492 (2013.01); H05K 7/20736 (2013.01); G06F 2213/0026 (2013.01);
Abstract

Systems, methods, apparatuses, and software for data systems are provided herein. In one example, a meshed computing architecture is presented that includes a midplane comprising PCIe interconnect, storage modules configured to couple to a first portion of the PCIe interconnect, controller modules configured to couple to a second portion of the PCIe interconnect, and fabric modules configured to couple to a third portion of the PCIe interconnect. The first portion of the PCIe interconnect communicatively couples each of the storage modules to each of the controller modules and each of the fabric modules, the second portion of the PCIe interconnect communicatively couples each of the controller modules to each of the fabric modules, and third portion of the PCIe interconnect communicatively couples the controller modules to each other.


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