The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Oct. 29, 2015
Tatsuta Electric Wire & Cable Co., Ltd., Osaka, JP;
Yoshihiko Aoyagi, Kyoto, JP;
Yoshinori Kawakami, Osaka, JP;
Yoshio Hirano, Kyoto, JP;
Kiyotaka Urashita, Kyoto, JP;
Ryota Fujikawa, Kyoto, JP;
Nobuhiro Fujio, Kyoto, JP;
TATSUTA ELECTRIC WIRE & CABLE CO., LTD., Osaka, JP;
Abstract
Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wireis placed on a preliminarily-soldered conductive joint portion. Then, the conductive joint portionsand the core wiresare covered with an optically-transparent sheet. Thus, the state in which the core wireis placed on the conductive joint portionis held. In this state, the optically-transparent sheetis irradiated with light. A preliminary solderis heated and melted to join the core wireand the conductive joint portiontogether.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile