The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Nov. 28, 2014
Applicant:

Toyo Aluminium Kabushiki Kaisha, Osaka-shi, Osaka, JP;

Inventors:

Kosuke Tsuji, Osaka, JP;

Kazunori Koike, Osaka, JP;

Katsura Kawashima, Osaka, JP;

Kenju Tsuchiya, Itami, JP;

Shinji Imai, Itami, JP;

Assignee:

TOYO ALUMINIUM KABUSHIKI KAISHA, Osaka-Shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/06 (2006.01); C23F 1/20 (2006.01); H05K 1/03 (2006.01); H05K 3/44 (2006.01);
U.S. Cl.
CPC ...
H05K 3/067 (2013.01); C23F 1/20 (2013.01); H05K 1/032 (2013.01); H05K 1/092 (2013.01); H05K 3/061 (2013.01); H05K 3/44 (2013.01); H05K 2203/0384 (2013.01); H05K 2203/0502 (2013.01);
Abstract

The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.


Find Patent Forward Citations

Tsuji, Kosuke. (2019). Method for manufacturing circuit board and circuit board (U.S. Patent No. 10206287). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10206287

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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