The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Dec. 11, 2012
Applicant:

Continental Automotive Gmbh, Hannover, DE;

Inventors:

Jan Keller, Lappersdorf, DE;

Thomas Riepl, Bad Abbach, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 1/02 (2006.01); H05K 13/00 (2006.01); G06F 21/87 (2013.01); G06F 21/86 (2013.01); H05K 7/00 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0275 (2013.01); G06F 21/86 (2013.01); G06F 21/87 (2013.01); H05K 13/00 (2013.01); G06F 2221/2101 (2013.01); H05K 1/11 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 3/28 (2013.01); H05K 2201/09218 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/10159 (2013.01); H05K 2203/175 (2013.01); H05K 2203/178 (2013.01);
Abstract

A control unit has a substrate with an electrically conductive structure, an integrated circuit device, which is installed on the substrate in an electrically conductive manner, and a sacrificial structure on the substrate. The sacrificial structure is configured to be irreversibly destroyed if the integrated circuit device is removed from the substrate. The electrically conductive structure has at least one conducting track applied to the substrate. The sacrificial structure is formed by a segment of the conducting track. An electrically insulating connecting layer that connects the integrated circuit device, the substrate, and the segment of the conducting track is formed. The sacrificial structure can be destroyed by the connecting layer when the integrated circuit device is removed.


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