The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Nov. 16, 2015
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Taku Kikuchi, Nagaokakyo, JP;

Masahiro Fukushima, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/25 (2006.01); H03H 9/10 (2006.01); H03H 9/145 (2006.01);
U.S. Cl.
CPC ...
H03H 9/25 (2013.01); H03H 9/02574 (2013.01); H03H 9/02834 (2013.01); H03H 9/02897 (2013.01); H03H 9/02992 (2013.01); H03H 9/1071 (2013.01); H03H 9/02559 (2013.01); H03H 9/02929 (2013.01); H03H 9/1042 (2013.01); H03H 9/14541 (2013.01);
Abstract

A surface acoustic wave device includes a piezoelectric substrate, a dielectric film, IDT electrodes, and a resin member. The surface acoustic wave device includes a resin contact region where the piezoelectric substrate and the resin member are in direct contact with each other. The resin contact region has a shape surrounding the IDT electrodes. Because the resin member exhibits a strong adhesion force with respect to the piezoelectric substrate, peeling-off between the piezoelectric substrate and the resin member is significantly reduced or prevented, and an airtight condition is maintained in the interior of the surface acoustic wave device.


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