The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Jun. 06, 2017
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Toshikazu Mukai, Kyoto, JP;

Kazuisao Tsuruda, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/16 (2006.01); G01N 21/35 (2014.01); H03B 7/08 (2006.01); G01N 21/3581 (2014.01); G01R 31/28 (2006.01); G01R 31/311 (2006.01); G02F 1/39 (2006.01); G02F 2/02 (2006.01); G02F 1/35 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/16 (2013.01); G01N 21/3581 (2013.01); G01R 31/2831 (2013.01); G01R 31/311 (2013.01); G02F 1/39 (2013.01); G02F 2/02 (2013.01); H03B 7/08 (2013.01); G02F 2001/3505 (2013.01); G02F 2203/13 (2013.01); H03B 2200/0084 (2013.01);
Abstract

THz device includes: a semiconductor substrate; a first semiconductor layer disposed on the semiconductor substrate; an active element formed by being laminated on the first semiconductor layer; a second electrode connected to the first semiconductor layer to be connected to a cathode K of the active element, the second electrode disposed on the semiconductor substrate; a first electrode connected to an anode A of the active element, the first electrode disposed on the semiconductor substrate to be opposite to the second electrode; a rear reflector metal layer disposed on a back side surface of the semiconductor substrate opposite to the first semiconductor layer, wherein the active element forms a resonator between the second and first electrodes, wherein electromagnetic waves are reflected on the rear reflector metal layer, and electromagnetic waves have a surface light-emission radiating pattern or surface light-receiving pattern in a vertical direction to the semiconductor substrate.


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