The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Oct. 10, 2016
Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Xiangyang Dai, East Amherst, NY (US);

Mark J. Roy, Buffalo, NY (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/06 (2006.01); H01M 2/22 (2006.01); H01M 2/26 (2006.01); H01M 2/30 (2006.01); B23K 26/20 (2014.01); H01M 4/38 (2006.01); H01M 4/40 (2006.01); H01M 4/485 (2010.01); H01M 4/505 (2010.01); H01M 4/525 (2010.01); H01M 4/58 (2010.01); H01M 4/66 (2006.01); H01M 10/052 (2010.01); H01M 2/02 (2006.01); B23K 101/38 (2006.01);
U.S. Cl.
CPC ...
H01M 2/26 (2013.01); B23K 26/20 (2013.01); H01M 2/065 (2013.01); H01M 2/22 (2013.01); H01M 2/30 (2013.01); H01M 4/382 (2013.01); H01M 4/405 (2013.01); H01M 4/485 (2013.01); H01M 4/505 (2013.01); H01M 4/525 (2013.01); H01M 4/5815 (2013.01); H01M 4/66 (2013.01); H01M 10/052 (2013.01); B23K 2101/38 (2018.08); H01M 2002/0205 (2013.01); H01M 2220/30 (2013.01);
Abstract

A process for creating a laser braze weld joint between a current collector and a terminal pin in the construction of electrochemical cells is described. The laser braze welding process utilizes a laser weld instrument to create a braze-like joint between two work pieces. The weld joint is created by controlling the amount of laser heat and energy imparted to the work pieces through proper control and positioning of the laser beam with respect to the work pieces. Preferably, the method is used to bond the terminal pin to the cathode current collector. This method of attachment is suitable for either primary or secondary cells, particularly those powering implantable biomedical devices.


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