The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Apr. 23, 2015
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Ordos Yuansheng Optoelectronics Co., Ltd., Ordos, Inner Mongolia, CN;

Inventors:

Zhiliang Jiang, Beijing, CN;

Fengli Ji, Beijing, CN;

Renrong Gai, Beijing, CN;

Minghua Xuan, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5246 (2013.01); H01L 27/32 (2013.01); H01L 51/56 (2013.01);
Abstract

An encapsulating method, a display panel and a display apparatus, the encapsulating method including: forming a frit layer in an encapsulating area of a first substrate; forming a glass network modifier oxide layer on the surface of the frit layer; a first-sintering for the frit layer and the glass network modifier oxide layer; and aligning and attaching the first substrate and a second substrate, and forming an encapsulating structure through irradiating the encapsulating area by a laser. The encapsulating method can improve the liquidity of the surface of the frit layer and make the surface of the frit planarization after sintering at high temperature, so that the production of the holes of the surface of the frit layer can be reduced in the process of being encapsulated by a laser, and then the effect of encapsulating is improved.


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