The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Mar. 09, 2017
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Yuichi Onozawa, Matsumoto, JP;

Kota Ohi, Matsumoto, JP;

Tatsuya Naito, Matsumoto, JP;

Misaki Takahashi, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 27/07 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/10 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 23/528 (2013.01); H01L 23/53257 (2013.01); H01L 27/0716 (2013.01); H01L 29/063 (2013.01); H01L 29/0615 (2013.01); H01L 29/0696 (2013.01); H01L 29/1095 (2013.01); H01L 29/407 (2013.01); H01L 29/4236 (2013.01); H01L 29/4238 (2013.01); H01L 29/8613 (2013.01); H01L 27/0727 (2013.01); H01L 29/0692 (2013.01);
Abstract

Provided is a semiconductor device comprising: a semiconductor substrate; a plurality of first trench portions formed at a front surface side of the semiconductor substrate and extending in a predetermined extending direction in a planar view; an emitter region of a first conductivity type formed between adjacent trenches of the plurality of first trench portions at the front surface side of the semiconductor substrate; a first contact region of a second conductivity type formed between the adjacent trenches of the plurality of first trench portions, the first contact region and the emitter region being arranged alternately in the extending direction; and a second contact region of a second conductivity type formed above the first contact region to be apart from the emitter region and having a higher doping concentration than the first contact region.


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