The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Aug. 23, 2016
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Barbara Behr, Abensberg, DE;

Mathias Wendt, Hausen, DE;

Marcus Zenger, Hausen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/485 (2006.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01); H01L 23/532 (2006.01); B23K 35/32 (2006.01); B23K 35/30 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 23/53266 (2013.01); H01L 24/26 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/62 (2013.01); B23K 35/3033 (2013.01); B23K 35/322 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29164 (2013.01); H01L 2224/29169 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A device and a method for producing a device are disclosed. In an embodiment the device includes a first component, a second component and a connecting element directly arranged between the first component and the second component, wherein the connecting element includes at least a first metal, which is formed as an adhesive layer, a diffusion barrier and a component of a first phase and a second phase of the connecting element, wherein the adhesive layer is arranged on the first component and/or the second component, wherein the first phase and/or the second phase includes, besides the first metal, further metals different from the first metal, wherein a concentration of the first metal in the first phase is greater than a concentration of the first metal in the second phase, and wherein the connecting element includes a layer of a silicide of the first metal.


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