The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Oct. 06, 2015
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Toshiyuki Kobayashi, Tokyo, JP;
Takuro Kanazawa, Tokyo, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
An object of the present invention is to provide a power module that secures a heat dissipation route and has increased reliability. A power module of the present invention includes a first circuit body having a first semiconductor element and a first conductor portion, a second circuit body having a second semiconductor element and a second conductor portion, a resin sealing material for sealing the first circuit body and the second circuit body, and a warpage suppression portion that is formed along an array direction of the first circuit body and the second circuit body and is formed to have greater rigidity than a sealing portion of the resin sealing material, wherein the warpage suppression portion is formed of the same material as a resin member of the resin sealing material and is formed to be thicker than the sealing portion of the resin sealing material.