The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Sep. 09, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Johann Kosub, Neutraubling, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C25D 3/38 (2006.01); C25D 5/52 (2006.01); C23F 1/18 (2006.01); H01L 21/02 (2006.01); H01L 21/321 (2006.01); H01L 21/3213 (2006.01); H01L 21/687 (2006.01); C23F 1/08 (2006.01); C23F 3/06 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); C23F 1/08 (2013.01); C23F 1/18 (2013.01); C23F 3/06 (2013.01); C25D 3/38 (2013.01); C25D 5/52 (2013.01); H01L 21/02052 (2013.01); H01L 21/32115 (2013.01); H01L 21/32134 (2013.01); H01L 21/6708 (2013.01); H01L 21/67023 (2013.01); H01L 21/6875 (2013.01); H01L 21/68728 (2013.01); H01L 21/7684 (2013.01); H01L 21/76808 (2013.01);
Abstract
In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The non-uniform top surface includes a plurality of protrusions. The method further includes removing the plurality of protrusions by exposing the layer to a fluid that has gas bubbles and a liquid.