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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10204733 B1

PDFFull Text
Expired
Date of Patent:
Feb. 12, 2019

Filed:

Jul. 06, 2016

Module substrate

Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Yuichi Sugiyama, Tokyo, JP;

Masashi Miyazaki, Tokyo, JP;

Yutaka Hata, Tokyo, JP;

Assignee:

TAIYO YUDEN CO., LTD., Tokyo, JP;

Attorney:

Chen Yoshimura LLP

Primary Examiner:

Ronald Hinson

Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01F 17/04 (2006.01); H01F 5/00 (2006.01); H01F 27/245 (2006.01); H01F 17/00 (2006.01); H01F 17/06 (2006.01); H05K 1/16 (2006.01); H01L 49/02 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 1/05 (2006.01); H05K 3/44 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0006 (2013.01); H01F 17/062 (2013.01); H01F 27/245 (2013.01); H01L 23/49822 (2013.01); H01L 28/00 (2013.01); H05K 1/165 (2013.01); H01F 2027/2814 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 1/056 (2013.01); H05K 1/181 (2013.01); H05K 3/445 (2013.01); H05K 2201/086 (2013.01);
Abstract

Provided is a module substrate including an inductor that can be made thinner and smaller. A module substrate according to an aspect of the present invention includes a substrate member having a mounting surface on which electronic components are mounted, a magnetic core disposed within the substrate member, and a conductor coil provided in the substrate member and wound around the magnetic core. The module substrate has a configuration in which an inductor is built into the substrate member, which makes it possible to make the overall module substrate smaller and thinner.

Find Patent Forward Citations

Sugiyama, Yuichi. (2019). Module substrate (U.S. Patent No. 10204733). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10204733

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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