The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Jul. 06, 2016
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01F 17/04 (2006.01); H01F 5/00 (2006.01); H01F 27/245 (2006.01); H01F 17/00 (2006.01); H01F 17/06 (2006.01); H05K 1/16 (2006.01); H01L 49/02 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 1/05 (2006.01); H05K 3/44 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0006 (2013.01); H01F 17/062 (2013.01); H01F 27/245 (2013.01); H01L 23/49822 (2013.01); H01L 28/00 (2013.01); H05K 1/165 (2013.01); H01F 2027/2814 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 1/056 (2013.01); H05K 1/181 (2013.01); H05K 3/445 (2013.01); H05K 2201/086 (2013.01);
Abstract
Provided is a module substrate including an inductor that can be made thinner and smaller. A module substrate according to an aspect of the present invention includes a substrate member having a mounting surface on which electronic components are mounted, a magnetic core disposed within the substrate member, and a conductor coil provided in the substrate member and wound around the magnetic core. The module substrate has a configuration in which an inductor is built into the substrate member, which makes it possible to make the overall module substrate smaller and thinner.