The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
May. 20, 2016
Applicant:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Inventors:
Byoung-Uk Yoon, Hwaseong-si, KR;
Min-Su Chang, Seoul, KR;
Soon-Ho Han, Hwaseong-si, KR;
Jong-Chul Choi, Suwon-si, KR;
Jeong-Hoon Oh, Yongin-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); B32B 38/18 (2006.01); B32B 37/10 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1633 (2013.01); B32B 38/1866 (2013.01); B32B 37/10 (2013.01); B32B 38/10 (2013.01); B32B 38/1833 (2013.01); B32B 2037/1072 (2013.01); B32B 2310/0843 (2013.01); B32B 2398/10 (2013.01); B32B 2457/00 (2013.01); G06F 2200/1633 (2013.01);
Abstract
According to various embodiments of the present disclosure, there is provided a fabrication method for fabricating an exterior member of an electronic device. The fabrication method may include a film disposing step of disposing a film on an exterior member in which one face is formed as a first curved face, and a lamination step of laminating the film on the exterior member. The fabrication method as described above may be variously implemented according to embodiments.