The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Feb. 08, 2016
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Andrew Bendtsen, Racine, WI (US);

Kurt Wilcox, Libertyville, IL (US);

Boris Karpichev, Libertyville, IL (US);

John Durkee, Raleigh, NC (US);

John Roberts, Durham, NC (US);

David Goelz, Milwaukee, WI (US);

Douglas E. Keiter, Apex, NC (US);

Randy Bernard, Cary, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F21V 15/01 (2006.01); F21V 23/00 (2015.01); F21V 23/04 (2006.01); F21V 29/74 (2015.01); F21V 31/00 (2006.01); F21V 5/04 (2006.01); F21V 7/00 (2006.01); H05B 33/08 (2006.01); F21V 29/83 (2015.01); F21V 17/16 (2006.01); H05B 37/02 (2006.01); F21S 8/00 (2006.01); F21V 29/508 (2015.01); F21V 29/89 (2015.01); F21V 13/04 (2006.01); F21V 23/06 (2006.01); F21Y 115/10 (2016.01); F21V 5/00 (2018.01); F21W 131/10 (2006.01); F21Y 113/00 (2016.01); F21Y 105/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/83 (2015.01); F21S 8/00 (2013.01); F21V 17/16 (2013.01); F21V 23/007 (2013.01); F21V 29/508 (2015.01); F21V 29/74 (2015.01); H05B 33/0803 (2013.01); H05B 37/0218 (2013.01); H05B 37/0227 (2013.01); F21V 5/007 (2013.01); F21V 5/045 (2013.01); F21V 7/0083 (2013.01); F21V 13/04 (2013.01); F21V 15/01 (2013.01); F21V 23/0442 (2013.01); F21V 23/06 (2013.01); F21V 29/89 (2015.01); F21V 31/00 (2013.01); F21W 2131/10 (2013.01); F21Y 2105/10 (2016.08); F21Y 2113/00 (2013.01); F21Y 2115/10 (2016.08);
Abstract

In one aspect, luminaires are described herein enabling independent thermal management of driver and LED assemblies. For example, a luminaire comprises a driver assembly vertically integrated with a LED assembly, the driver assembly comprising a driver heatsink having an interior in which a circuit board assembly is positioned, and the LED assembly comprising an array of LEDs and LED heatsink, wherein a barrier is positioned between the driver heatsink and the LED heatsink, separating convective cooling of the driver assembly from convective cooling of the LED assembly.


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