The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Aug. 26, 2015
Jnc Corporation, Tokyo, JP;
Osaka Municipal Technical Research Institute, Osaka, JP;
Takeshi Fujiwara, Chiba, JP;
Jyunichi Inagaki, Chiba, JP;
Masako Hinatsu, Chiba, JP;
Akinori Okada, Osaka, JP;
Yasuyuki Agari, Osaka, JP;
Hiroshi Hirano, Osaka, JP;
Joji Kadota, Osaka, JP;
JNC CORPORATION, Tokyo, JP;
Osaka Research Institute of Industrial Science and Technology, Osaka-Fu, JP;
Abstract
The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.