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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10202525 B1

PDFFull Text
Date of Patent:
Feb. 12, 2019

Filed:

Aug. 05, 2014

Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Sang Min Park, Daejeon, KR;

Yoon Gyung Cho, Daejeon, KR;

Kyung Yul Bae, Daejeon, KR;

Hyun Jee Yoo, Daejeon, KR;

Jung Sup Shim, Daejeon, KR;

Min Soo Park, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:

Dentons US LLP

Primary Examiner:

Anish P Desai

Int. Cl.
CPC ...
H01L 51/00 (2006.01); C09J 109/00 (2006.01); H01L 51/56 (2006.01); H01L 51/52 (2006.01); C09J 9/00 (2006.01); C09J 4/00 (2006.01); C09J 7/00 (2018.01); C09J 123/22 (2006.01); C09J 133/08 (2006.01); C09J 145/00 (2006.01); C09J 7/20 (2018.01); C09J 7/10 (2018.01);
U.S. Cl.
CPC ...
C09J 109/00 (2013.01); C09J 4/00 (2013.01); C09J 7/00 (2013.01); C09J 7/10 (2018.01); C09J 7/20 (2018.01); C09J 9/00 (2013.01); C09J 123/22 (2013.01); C09J 133/08 (2013.01); C09J 145/00 (2013.01); H01L 51/0001 (2013.01); H01L 51/004 (2013.01); H01L 51/0026 (2013.01); H01L 51/0043 (2013.01); H01L 51/0094 (2013.01); H01L 51/5237 (2013.01); H01L 51/5246 (2013.01); H01L 51/5253 (2013.01); H01L 51/5256 (2013.01); H01L 51/5259 (2013.01); H01L 51/56 (2013.01); C09J 2201/36 (2013.01); C09J 2201/606 (2013.01); C09J 2203/326 (2013.01); C09J 2205/114 (2013.01); C09J 2409/00 (2013.01); C09J 2415/003 (2013.01); C09J 2423/00 (2013.01); C09J 2423/003 (2013.01); C09J 2433/003 (2013.01); Y10T 428/2883 (2015.01);
Abstract

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

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