The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Jan. 29, 2015
Applicant:

Mitsubishi Hitec Paper Europe Gmbh, Bielefeld, DE;

Inventors:

Gerhard Stork, Flensburg, DE;

Nora Wilke, Flensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41M 5/337 (2006.01); B60H 1/00 (2006.01); B60L 11/00 (2006.01); G06F 3/00 (2006.01); B41M 5/327 (2006.01); B41M 5/333 (2006.01);
U.S. Cl.
CPC ...
B60H 1/00 (2013.01); B41M 5/3372 (2013.01); B60L 11/00 (2013.01); G06F 3/002 (2013.01); B41M 5/3275 (2013.01); B41M 5/337 (2013.01); B41M 5/3336 (2013.01); B41M 2205/04 (2013.01);
Abstract

A heat-sensitive recording material suitable for offset printing, having a web-shaped substrate, having a front side and a reverse side opposite the front side, a heat-sensitive recording layer disposed at least on one of the two sides of the web-shaped substrate having at least one dye precursor and at least one (color) developer reactive with the dye precursor. The heat-sensitive recording layer has particles including an organic surface whose extent in the direction of the thickness of web-shaped substrate and heat-sensitive recording layer is greater than the thickness of the heat-sensitive recording layer.


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