The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Dec. 05, 2013
Applicant:

Seho Systemtechnik Gmbh, Kreuzwertheim, DE;

Inventors:

Bernd Dreikorn, Wertheim, DE;

Thomas Herz, Kreuzwertheim, DE;

Reiner Zoch, Radeberg, DE;

Markus Walter, Wertheim, DE;

Assignee:

SEHO SYSTEMTECHNIK GMBH, Kreuzwertheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/06 (2006.01); B23K 1/00 (2006.01); B23K 37/00 (2006.01); H05K 3/34 (2006.01); B23K 1/08 (2006.01); B23K 1/20 (2006.01); B23K 3/08 (2006.01); B23K 37/04 (2006.01); B23K 37/06 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0607 (2013.01); B23K 1/0016 (2013.01); B23K 1/08 (2013.01); B23K 1/085 (2013.01); B23K 1/20 (2013.01); B23K 3/0646 (2013.01); B23K 3/082 (2013.01); B23K 37/04 (2013.01); B23K 37/06 (2013.01); H05K 3/34 (2013.01); H05K 3/3468 (2013.01); B23K 2101/42 (2018.08); H05K 2203/04 (2013.01); H05K 2203/044 (2013.01); H05K 2203/1509 (2013.01);
Abstract

A soldering apparatus for selective soldering, comprising


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