The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Dec. 05, 2013
Applicant:
Seho Systemtechnik Gmbh, Kreuzwertheim, DE;
Inventors:
Bernd Dreikorn, Wertheim, DE;
Thomas Herz, Kreuzwertheim, DE;
Reiner Zoch, Radeberg, DE;
Markus Walter, Wertheim, DE;
Assignee:
SEHO SYSTEMTECHNIK GMBH, Kreuzwertheim, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/06 (2006.01); B23K 1/00 (2006.01); B23K 37/00 (2006.01); H05K 3/34 (2006.01); B23K 1/08 (2006.01); B23K 1/20 (2006.01); B23K 3/08 (2006.01); B23K 37/04 (2006.01); B23K 37/06 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0607 (2013.01); B23K 1/0016 (2013.01); B23K 1/08 (2013.01); B23K 1/085 (2013.01); B23K 1/20 (2013.01); B23K 3/0646 (2013.01); B23K 3/082 (2013.01); B23K 37/04 (2013.01); B23K 37/06 (2013.01); H05K 3/34 (2013.01); H05K 3/3468 (2013.01); B23K 2101/42 (2018.08); H05K 2203/04 (2013.01); H05K 2203/044 (2013.01); H05K 2203/1509 (2013.01);
Abstract
A soldering apparatus for selective soldering, comprising
Dreikorn, Bernd. (2019). Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device (U.S. Patent No. 10201866). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10201866
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile