The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
May. 02, 2013
Industry-university Cooperation Foundation Sogang University, Seoul, KR;
Kwan Woo Shin, Seoul, KR;
Hyo Jin Ko, Seoul, KR;
Oh-Sun Kwon, Seoul, KR;
Jae Hak Choi, Daejeon, KR;
Byeong No Lee, Seoul, KR;
Ju Mi Lee, Seoul, KR;
Abstract
The present invention relates to a method for manufacturing a module type microfluidic chip comprising: (a) printing electrode patterns on a substrate using a conductive ink and inkjet printing; (b) cutting the printed electrode patterns; and (c) assembling the cut electrode patterns to manufacture the module type microfluidic paper chip. Unlike the traditional method for manufacturing printed circuit substrate using a patterning agent or device, the method of the present invention only incorporates a simple printing process using an inkjet printer, and thus patterning can be simplified and various types of chips can be manufactured depending on the assembly type of electrode patterns. Accordingly, inexpensive, economical, and highly utilizable microfluidic chips can be provided using the method of the present invention.